With the rapid advancement of wireless communication technologies and electronic devices, electromagnetic interference (EMI) has emerged as a critical factor affecting the reliability and performance of electronic systems. This is particularly true in high-demand sectors such as aerospace, defense, and next-generation communication networks. Traditional EMI shielding materials, including metal and carbon-based composites, face inherent limitations such as high weight, susceptibility to corrosion, and insufficient environmental stability. In response, ceramic-based EMI shielding materials have attracted increasing attention as promising alternatives due to their tunable dielectric and magnetic properties, superior thermal and chemical stability, and favorable cost-effectiveness.
Nevertheless, challenges remain in optimizing their electrical conductivity and microstructural design to achieve high-efficiency EMI shielding performance. The development of ceramic materials that combine lightweight characteristics, high mechanical strength, thermal stability, and excellent EMI shielding effectiveness is essential for addressing the growing demands posed by complex electromagnetic environments.
Breakthrough Research from Zhengzhou University
Recently, a team of material scientists led by Bingbing Fan from Zhengzhou University, China, conducted a comprehensive analysis of the EMI shielding mechanisms, advanced synthesis techniques, and material optimization strategies for ceramic-based EMI shielding materials. Their findings were published in the Journal of Advanced Ceramics on October 27, 2025.
“In this report, we systematically examined the research advancements in ceramic-based EMI shielding materials from two perspectives: the fundamental principles of EMI shielding and structural optimization design. It emphasizes that the rational design of such materials necessitates a comprehensive evaluation of the synergistic interactions among electrical conductivity, dielectric properties, and microstructural characteristics,” said Bingbing Fan, professor at the School of Materials Science and Engineering at Zhengzhou University.
Understanding the Mechanisms and Challenges
According to the study, in the medium to high-temperature range (300–600°C), the electrical conductivity and EMI shielding performance of traditional ceramics are typically enhanced via doping or integration with carbonaceous materials. However, when temperatures exceed 1000°C, the dominant shielding mechanism transitions from conduction loss to a more complex absorption-dominated process driven by dielectric relaxation, interface polarization, and other related phenomena. This shift is observed in both conventional and emerging high-entropy ceramics.
“Prolonged exposure to elevated temperatures may induce detrimental effects such as oxidation and phase transformations, resulting in degradation of EMI shielding performance,” Bingbing Fan noted.
The complexity of high-entropy ceramics, characterized by their compositional complexity and multi-scale nature, poses additional challenges. Traditional trial-and-error approaches are increasingly insufficient. Fortunately, first-principles calculations provide insights into electronic structures, mechanical stability, and thermophysical properties, aiding in the screening of promising candidate components.
Future Directions and Technological Innovations
The research team highlighted several areas for future exploration:
- Wideband Compatibility Design: Developing frequency-adaptive ceramic composites to meet the communication demands of 5G/6G and terahertz technologies.
- Multifunctional Integration: Integrating EMI shielding with thermal management, mechanical load-bearing, and environmental protection to address the requirements of extreme environments such as aerospace and high-power electronics.
- Smart Responsive Materials: Investigating ceramics capable of responding to temperature, electric, or magnetic fields for dynamic shielding regulation.
- AI-driven Innovation: Leveraging machine learning and high-throughput computational methods to accelerate material discovery, performance prediction, and process optimization, thereby overcoming the limitations of traditional trial-and-error approaches.
Other contributors to the study include Yang Li, Mengying Zhang, Jianing Chen, Xianhu Liu, Ming Huang, Chuntai Liu, Gang Shao, and Hailong Wang from Zhengzhou University, as well as Yuchang Qing from Northwestern Polytechnical University in Xi’an, China. The research was supported by several prestigious foundations, including the National Natural Science Foundation of China and the Henan Province science and technology research project.
Implications for the Future of Electronics
The implications of this research are significant for the future of electronics and communication technologies. As the demand for more efficient and reliable EMI shielding materials grows, the development of advanced ceramics could play a pivotal role in meeting these needs. The integration of AI and machine learning in material science represents a transformative approach that could accelerate innovation and reduce the time from research to application.
As industries continue to push the boundaries of technology, the insights gained from this research could pave the way for new materials and strategies that enhance the performance and reliability of electronic systems in increasingly complex electromagnetic environments.
